Spatial resolutionUp to billions of pixels

Wavelength rangevisible light

Spectral resolutionUp to 0.5nm

Packaging formsChip,module,etc.

Data interfacesSPI,MIPI,etc.

Product Positioning

Engineered to help manufacturers of mid-to-high-end smartphones, professional cameras, handheld imaging devices and live-streaming equipment achieve flagship-grade imaging upgrades. Already in commercial mass production with benchmark customer designs, the sensor carries no adoption risk for new programs.

Key Features

Built on an advanced 40 nm stacked logic-layer process, the SEE6811X outperforms other multispectral CIS devices currently in mass production, with ultra-low power consumption, the smallest footprint in its class and native support for dual conversion gain (DCG) HDR.

Featuring a 3.2 MP physical pixel array and 9 broadband spectral channels, it captures fine spectral detail alongside high-fidelity spatial information. A production-ready calibration and correction algorithm suite and an AI-based auto white balance (AWB) imaging algorithm package are supplied alongside, enabling customers to reconstruct an RGB color reference baseline and achieve markedly more accurate color reproduction.

Product Positioning

Compared with the SEE6811X series, the SEE6812A raises native resolution to 5 MP while lowering cost, making it a highly cost-effective choice for auxiliary color optimization in imaging systems.

Key Features

Manufactured on a mature, production-proven backside-illuminated (BSI) CMOS image sensor (CIS) process, the SEE6812A integrates as many as 12 broadband spectral channels and a 5 MP physical pixel array in a 4:3 aspect ratio, housed in an ultra-compact 1/5.5-inch optical format. It is especially well suited to multi-camera arrays and high-magnification telephoto modules where improved color accuracy is required.

Product Positioning

Designed to help manufacturers of premium smartphones, professional cameras, handheld imaging devices and live-streaming equipment achieve outstanding flagship-grade brightness and color performance, the SEE6830X is the preferred choice for next-generation product roadmaps.

Key Features

Built on the same advanced 40 nm stacked logic-layer process as the SEE6811X and carrying forward its 3.2 MP physical pixel array, the SEE6830X retains the series' hallmark ultra-low power consumption, minimal footprint and DCG HDR performance — while upgrading the spectral layer to 16 channels for higher color accuracy.